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Conference Venue

 

Kwansei Gakuin University
Osaka Umeda Campus

 





Latest News

ICMENS 2021 have been published online in Solid State Phenomena (Vol. 324)! (More)

2021-9-22 News!


ICMENS 2022 will be held in Osaka, Japan during March 23-25, 2022!

2021-5-25 News!


ICMENS 2021 was successfully held virtually during March 23-25, 2021!

2021-4-1 News!


Welcome Prof. Jun’ichiro MIZUKI, Kwansei Gakuin University, Japan join ICMENS 2021 as Invited Speaker!

2020-10-26 News!


Welcome Dr. Motohiro SUZUKI, Japan Synchrotron Radiation Research Institute (JASRI), Japan join ICMENS 2021 as Invited Speaker!

2020-10-15 News!


ICMENS 2021 was announced in the website of Processes, a SCIE journal under MDPI! (More)

2020-9-3 News!


Welcome Prof. Pramoch Rangsunvigit (Chulalongkorn University, Thailand) join ICMENS 2021 as Invited Speaker!

2020-8-6 News!


ICMENS 2020 papers have been indexed by Scopus! (More)

2020-7-13 News!


Welcome Prof. Akira Toriumi, IEEE Fellow, The University of Tokyo, Japan join ICMENS 2021 as Keynote Speaker!

2020-7-3 News!


ICMENS 2020 papers have been published in IOP Conference Series: Materials Science and Engineering- Volume 840! (More)

2020-6-13 News!



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Welcome to 6th ICMENS 2022

2022 6th International Conference on Materials Engineering and Nano Sciences (ICMENS 2022) will be held in Osaka, Japan during March 23-25, 2022, sponsored by Kwansei Gakuin University, Japan.


Materials Engineering based on Nano Sciences is a key ingredient of current advanced technologies supporting modern society, especially Information and Energy Technologies. The tremendous rapid growth of these fields makes them highly interdisciplinary and then inevitably demands their mutual interactions. Under these circumstances, the 2022 6th International Conference on Materials Engineering and Nano Sciences (ICMENS 2022) was organized as a series of successful international conferences held in Singapore (2017), Hong Kong (2018), Hiroshima (2019, Japan), Pattaya (2020, Thailand), and Virtual (2021).

The main goal of ICMENS is to address latest original results in Materials Engineering and Nano Sciences, including both theoretical advances and practical implementations, which are becoming more and more popular in industry and in our daily lives. ICMENS will provide a premier interdisciplinary platform for scientists, researchers, industry leaders, engineers and educators throughout the world to present and discuss the most recent innovations, trends, concerns, as well as practical challenges encountered, and streamline solutions in the fields of Materials Engineering and Nano Sciences. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in Quantum Technology.

The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ICMENS 2022.

 

 


 

Publication

Accepted papers with proper registration and presentation will be published into Materials Science Forum, (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Scopus, Ei Compendex etc.

 

 




Previous Proceedings:

ICMENS 2021: Solid State Phenomena-Vol.324【ISBN: 978-3-0357-1859-1】

ICMENS 2020: IOP Conference Series: Materials Science and Engineering-Vol.840 and indexed by Scopus.

ICMENS 2019: IOP Conference Series: Materials Science and Engineering-Vol.625 and indexed by Ei Compendex and Scopus.

ICMENS 2018: IOP Conference Series: Materials Science and Engineering-Vol.378 and indexed by Ei Compendex and Scopus.



 

Submission Guide

Please submit your full paper or abstract by iConf submission system. Official language is English in paper writing and presenting. The paper should be no less than 5 pages.

 

If you'd like to attend the conference only without paper publication and presention, you can make the registration directly. (Register Now!)

 


 

Photos Gallery

ICMENS 2017 @ Singapore

 

ICMENS 2018 @ Hong Kong

 

ICMENS 2019 @ Hiroshima, Japan

 

ICMENS 2020 @ Pattaya, Thailand

 

ICMENS 2021 @ Virtual Platform

 


 


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