Home > 2026 Keynote Speakers
Hideaki Tsukamoto
Hosei University, Japan
Biography: Prof. Hideaki Tsukamoto is currently a full Professor in Department of Mechanical Engineering, Faculty of Science and Engineering, Hosei University, Japan. Prof. Tsukamoto received his bachelor’s degree in metallurgical engineering from Tokyo Institute of Technology, Japan in 1988, and his master’s degree in Materials Science from Tokyo Institute of Technology, Japan in 1990. He received his PhD in Materials Science from Tokyo Institute of Technology, Japan in 2002, and another PhD in Mechanical Engineering from The University of Adelaide, Australia in 2008. He was working as an assistant professor at Tokyo Institute of Technology, Japan from 1990 to 2003. He moved to Australia in 2005 and was working at The University of Queensland from 2008 to 2011. Since 2016, he has been working as a full professor at Hosei University, Japan. His research targets and interests include metal matrix composites (MMCs), ceramic matrix composites (CMCs), functionally graded materials (FGMs), high temperature materials, and their thermo-mechanical behavior. He has been also engaging in micromechanics of the composites.
Shigeru Nagasawa
Sanjo City University, Japan
Biography: Prof. Shigeru Nagasawa is currently a full professor in Faculty of Engineering, Sanjo City University. Prof. Shigeru Nagasawa received his bachelor's degree in mechanical engineering from Nagaoka University of Technology, Japan in 1980, and his master's degree in mechanical engineering from Nagaoka University of Technology, Japan in 1982. He received his PhD in Information and Control Engineering from Nagaoka University of Technology, Japan in 1991. He was working as an engineer at Kobe Steel Co. Ltd, Japan from 1982 to 1987. He moved to Nagaoka University of Technology, Japan in 1987 and he was working as a full professor at Nagaoka University of Technology, Japan from 2013 to 2022. Since 2022, he has been working as a full professor at Sanjo City University, Japan. His research targets include Materials Processing (bending, shearing, drawing, rolling), Plasticity of paperboard and resin sheets, Die cutting, Computational Mechanics and Intelligent Support Environment.